i3 Electronics announces plans to sell its printed circuit board division


Another portion of the computing legacy of IBM is being dismantled in Endicott.

 i3 Electronics has announced plans to sell off its printed circuit board division, along with the accompanying intellectual property to TTM Technologies of Chippawa Falls, Wisconsin.

TTM says it is acquiring equipment, patents and critical manufacturing know-how based on i3’s technology base and pedigree which dates back to when the operation was owned by IBM.

The equipment will be moved from the Huron Campus in Endicott to Wisconsin and engineers working there will be considered for over 300 open positions that TTM has in North America.

The global printed circuit board and radio frequency components manufacturer says it was particularly interested in i3’s cutting edge technology that allows for very fine lines and spacing down to 25 microns which is an increasing requirement of defense and commercial customers.

i3 President and CEO Jim Matthews says the sale was a difficult decision, but necessary as the company had recently completed final production for its largest customer and was facing softened demand and a significant loss in revenue.

Matthews says i3 will continue to have a small operation in Endicott in its Flex and Glass Panel division and will be able to shift some workers to its i3 Assembly operation in Binghamton which is growing in its work for the Departments of Defense and Homeland Security.


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