Binghamton University is partnering with another research school in looking to develop new ways to make consumer electronics even smaller.
BU announced last week that it’s forming a multi-million dollar research center along with Purdue University to study the placement of multiple devices such as transistors onto a single platform such as a microchip.
The Center for Heterogeneous Integration Research in Packaging, or CHIRP, is being funded by the Semiconductor Research Corporation, a consortium of companies that make silicon chips for electronic systems including IBM, Intel, Samsung and Texas Instruments.
BU’s Vice President for Research, Bahgat Sammakia, says that as transistors near the limit of how small they can be, new efficiencies are achieved by bundling the tiny devices together. “It allows you to continue to develop products that are faster and that perform more in smaller volume and smaller weight by bringing chips close together as opposed to just shrinking transistors. That’s really the advantage of heterogeneous integration, it’s continuing to perform as though you were shrinking the transistors without really shrinking them.”
Sammakia says the two schools will look at issues surrounding reliability, energy usage, compatibility among competitors’ devices and cost.
He says what they discover will have a direct impact on the size and capabilities of the smart phones and laptops that we use, as well as further efforts toward developing artificial intelligence.